Description

FEATURES:

• Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics
• Easily removes solder from components or pads on a circuit board
• Concentrated fine copper braiding utilizes less length of wick for each desoldering application
• Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering
• 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard
• Formulated with a flux designed for higher activation temperatures
• To be used in conjunction with processes using RMA type no-clean fluxes
• Uses flux classification type L0 per IPC J-STD-004B – compatible with R, RA, RMA, and NC type fluxes